相關(guān)文章
您現(xiàn)在位置：首頁(yè) > 產(chǎn)品中心 >Logitech精密材料表面處理>薄片制備系統(tǒng)
| 產(chǎn)品圖片 | 產(chǎn)品名稱(chēng)/型號(hào) | 產(chǎn)品描述 |
-
Logitech PLJ Precision Lapping Jigs are used to hold multiple “wafer geometry” or slide mounted specimens, while they are being processed on a Logitech precision lapping machine. -
The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes. -
The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate （e.g. glass microscope slide） for support during processing. -
For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use
共 4 條記錄，當(dāng)前 1 / 1 頁(yè) 首頁(yè) 上一頁(yè) 下一頁(yè) 末頁(yè) 跳轉(zhuǎn)到第頁(yè)
